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MP03XXX360
MP03XXX360
Dual Thyristor, Thyristor/Diode Module
Replaces January 2000 version, DS4484-5.0 DS4484-6.1 June 2001
FEATURES
s s s s s
Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium
KEY PARAMETERS VDRM IT(AV) ITSM(per arm) Visol
1800V 355A 8100A 3000V
G1 K1 K2 G2 1 2 Circuit type code: HBT G1 K1 1 2 Circuit type code: HBP K2 G2 3 3
APPLICATIONS
s s s s
Motor Control Controlled Rectifier Bridges Heater Control AC Phase Control
VOLTAGE RATINGS
Type Number Repetitive Peak Voltages VDRM VRRM V 1800 1600 1400 1200 1000 800 Conditions
1
2 Circuit type code: HBN
3
Fig. 1 Circuit diagrams Tvj = 0 to 125C, IDRM = IRRM = 30mA VDSM = VRSM = VDRM = VRRM + 100V respectively
1 2 3 K2 G2 G1 K1
MP03XXX360-18 MP03XXX360-16 MP03XXX360-14 MP03XXX360-12 MP03XXX360-10 MP03XXX360-08
Lower voltage grades available. XXX shown in the part number above represents the circuit configuration required.
ORDERING INFORMATION
Order As: MP03HBT360-XX MP03HBN360-XX MP03HBP360-XX XX shown in the part number above represents the VRRM/100 slection required, e.g. MP03HBT360-17 Note: When ordering, please use the complete part number. Outline type code: MP03 Fig. 2 Electrical connections - (not to scale)
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MP03XXX360
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Symbol IT(AV) Parameter Mean on-state current Test Conditions Half wave resistive load Tcase = 75C Tcase = 85C Theatsink = 75C Theatsink = 85C IT(RMS ITSM I2t ITSM I2t Visol RMS value Surge (non-repetitive) on-current I2t for fusing Surge (non-repetitive) on-current I2t for fusing Isolation voltage Tcase = 75C 10ms half sine, Tj = 130C VR = 0 10ms half sine, Tj = 130C VR = 50% VDRM Commoned terminals to base plate. AC RMS, 1 min, 50Hz Max. 355 312 276 242 560 8.1 0.33x106 6.5 0.21x106 3000 Units A A A A A kA A2s kA A2s V
THERMAL AND MECHANICAL RATINGS
Symbol Rth(j-c) Parameter Thermal resistance - junction to case (per thyristor or diode) dc Half wave 3 Phase Rth(c-hs) Thermal resistance - case to heatsink (per thyristor or diode) Tvj Tstg Virtual junction temperature Storage temperature range Screw torque Mounting - M5 Electrical connections - M8 Weight (nominal) Mounting torque = 5Nm with mounting compound Reverse (blocking) -40 135 135 5(44) 9(80) 950 C C Nm (lb.ins) Nm (lb.ins) g Test Conditions Min. Max. 0.105 0.115 0.12 0.05 Units C/kW C/kW C/kW C/kW
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MP03XXX360
DYNAMIC CHARACTERISTICS - THYRISTOR
Symbol IRRM/IDRM dV/dt dI/dt Parameter Peak reverse and off-state current Linear rate of rise of off-state voltage Rate of rise of on-state current Test Conditions At VRRM/VDRM, Tj = 130C To 67% VDRM, Tj = 130C From 67% VDRM to 600A, gate source 10V, 5 tr = 0.5s, Tj = 130C VT(TO) rT Threshold voltage On-state slope resistance At Tvj = 135C. See note 1 At Tvj = 135C. See note 1 0.78 0.79 V m Min. Max. 50 1000 500 Units mA V/s A/s
Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol VGT IGT VGD VFGM VFGN VRGM IFGM PGM PG(AV) Parameter Gate trigger voltage Gate trigger current Gate non-trigger voltage Peak forward gate voltage Peak forward gate voltage Peak reverse gate voltage Peak forward gate current Peak gate power Mean gate power Test Conditions VDRM = 5V, Tcase = 25oC VDRM = 5V, Tcase = 25oC At VDRM Tcase = 125oC Anode positive with respect to cathode Anode negative with respect to cathode Anode positive with respect to cathode See table fig. 5 Max. 3 150 0.25 30 0.25 5 10 100 5 Units V mA V V V V A W W
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MP03XXX360
1600 Measured under pulse conditions 1400 Tj = 135C
20 I2t = I2 x t 2
Peak half sine wave on-state current - (kA)
Instantaneous on-state current, IT - (A)
1200 1000 800 600
15
10
200
I2t value - (A2s x 103)
400 200
5
I2t
175
0 0.6
0.8
1.0
1.2
1.4
1.6
1.8
0 1 ms
10
1
2 3 45
10
150 20 30 50
Instantaneous on-state voltage, VT - (V)
Cycles at 50Hz Duration
Fig. 3 Maximum (limit) on-state characteristics
Fig. 4 Surge (non-repetitive) on-state current vs time (with 50% VRSM at Tcase = 130C)
0.15
100
Thermal impedance, Rth(j-c) - (C/W)
Gate trigger voltage, VGT - (V)
Pulse width Frequency Hz Table gives pulse power PGM in Watts 10 s 50 100 400 70 5 0 5W W 20 100 100 100 W 25 VFGM 100 100 100 10 100 100 100 100 5W W 500 100 100 25 1ms 100 50 10 10ms 10 - -
d.c.
0.10
Tj = 25C
Tj = -40C
%
Tj = 125C
pe
0.1 0.001
Lo we
Up
rL
1
rL
im
Region of certain triggering
99
im
it 1 %
it
0.05
0.01 0.1 IGD Gate trigger current, I
0.1 - (A)
10 IFGM
0 0.001
0.01
0.1
GT
1.0 Time - (s)
10
100
Fig. 5 Gate characteristics
Fig. 6 Transient thermal impedance - dc
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MP03XXX360
1100 Conduction angle 30 1000 60 90 120 900 180 Power dissipation (Watts, per arm) 800 700 600 500 400 300 200 100 0 0 50 100 150 200 250 300 350 400 450 500 550 Sine wave current (Average, per arm)
1100 1000
Power dissipation (Watts, per arm)
Conduction angle 30 60 90 120 900 180 DC 800 700 600 500 400 300 200 100 0 0 50 150 250 350 450 550 650 Square wave current (Average, per arm) 750
Fig. 7 On-state power loss per arm vs on-state current at specified conduction angles, sine wave 50/60Hz
Fig. 8 On-state power loss per arm vs on-state current at specified conduction angles, square wave 50/60Hz
100 90 Conduction angle 30 60 90 120 180
100 90
Maximum permissble case temperature - (C)
Maximum permissible case temperature - (C)
80 70 60 50 40 30 20 10 0 100
80 70 60 50 40 30 20 10 0 100
Conduction angle 30 60 90 120 180 DC
150
200
250
300
350
400
450
500
550
Sine wave current (Average, per arm) - (A)
200 300 400 500 600 700 Square wave current (Average, per arm) - (A)
800
Fig. 9 Maximum permissible case temperature vs on-state current at specified conduction angles, sine wave 50/60Hz
Fig. 10 Maximum permissible case temperature vs on-state current at specified conduction angles, square wave 50/60Hz
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MP03XXX360
1600 1400 1200 1000 800 600 400 200 0 20
1600 Rth(hs-a) 0.02 0.04 0.08 0.1 0.12 0.15 0.2 0.3 0.4 R - Load L - Load 1400 1200 1000 800 600 400 200 0 600
Single phase bridge total device losses - (W)
Single phase bridge total device losses - (W)
30
40 50 60 70 80 90 100 110 120 Maximum ambient temperature - (C)
0
100 200 300 400 500 Single phase bridge DC output current (A)
Fig. 11 50/60Hz single phase bridge DC output current vs power loss and maximum permissible case temperature for specified values of heatsink thermal resistance
1600 1400 3 Phase bridge total device losses - (W) 1200 1000 800 600 400 200 0 20
1600 Rth(hs-a) 0.02 0.04 0.08 0.1 0.12 0.15 0.2 0.3 0.4 R & L Load 1400 1200 Total device loss - (Watts) 1000 800 600 400 200 0 600
30
40 50 60 70 80 90 100 110 120 Maximum ambient temperature - (C)
0
100 200 300 400 500 3 Phase bridge output DC current - (A)
Fig. 12 Fig. 11 50/60Hz Three phase bridge DC output current vs power loss and maximum permissible case temperature for specified values of heatsink thermal resistance
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MP03XXX360
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
42.5 O5.5 35 28.5 5
38
G1 K1
80 115 3x M8
5
2.8x0.8
52
32
92
Recommended fixings for mounting: M5 socket head cap screws. Nominal weight: 950g Auxiliary gate/cathode leads are not supplied but may be purchsed separately. Module outline type code: MP03
6.5
50
18
1
2
3
K2 G2
5
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MP03XXX360
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base temperature at 75C if full rated current is to be achieved. Power dissipation may be calculated by use of VT(TO) and rT information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required. The heatsink surface must be smooth and flat; a surface finish of N6 (32in) and a flatness within 0.05mm (0.002") are recommended. An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance. After application of thermal compound, place the module squarely over the mounting holes, (or `T' slots) in the heatsink. Using a torque wrench, slowly a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 6Nm (55lb.ins) is reached at both ends. It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module.
Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain.
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of Dynex semiconductors. An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.
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MP03XXX360
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS4484-6 Issue No. 6.1 June 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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